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ESD7M5.0DT5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra ? Low
Capacitance
The ESD7M5.0DT5G is designed to protect voltage sensitive
components from damage due to ESD in applications that require ultra
low capacitance to preserve signal integrity. Excellent clamping
capability, low leakage and fast response time are combined with an
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ultra low diode capacitance of 2.5 pF to provide best in class
protection from IC damage due to ESD. The ultra small SOT ? 723
package is ideal for designs where board space is at a premium. The
PIN 1. CATHODE
2. CATHODE
3. ANODE
1
2
3
ESD7M5.0DT5G can be used to protect two uni ? directional lines or
one bi ? directional line. When used to protect one bi ? directional line,
the effective capacitance is 1.25 pF. Because of its low capacitance, it
is well suited for protecting high frequency signal lines such as
USB2.0 high speed and antenna line applications.
Specification Features:
? Low Capacitance 2.5 pF Max
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.047” x 0.047” (1.20 mm x 1.20 mm)
? Low Body Height: 0.020 ″ (0.5 mm)
? Stand ? off Voltage: 5 V
? Low Leakage
? Response Time is Typically < 1.0 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? AEC ? Q101 Qualified and PPAP Capable
? This is a Pb ? Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
SOT ? 723
CASE 631AA
MARKING DIAGRAM
L7 M
1
L7 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping ?
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
ESD7M5.0DT5G
SOT ? 723
(Pb ? Free)
8000/Tape & Reel
MAXIMUM RATINGS
Rating
IEC 61000 ? 4 ? 2 (ESD)
Contact
Symbol
Value
± 10
Unit
kV
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
° P D °
T stg
T J
T L
150
? 55 to +150
? 55 to +125
260
mW
° C
° C
° C
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 4
1
Publication Order Number:
ESD7M5.0D/D
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